Nowadays, electronic components are moving toward miniaturization, and packaging is gradually moving toward cheaper. General electronic components are all plastic packages. However, the downside of the plastic package is that the humid gas enters the inside of the device through the joint surface of the package material and the component. On the one hand, the internal circuit is oxidized and corroded, and on the other hand, the high temperature during the assembly and soldering of the electronic component causes The humid gas entering the interior of the IC is thermally expanded to generate sufficient pressure to cause separation (delamination), wire bond damage, chip damage, and internal cracks. More severe cracks can extend to the surface of the component, causing the component to bulge and burst. According to statistics, more than a quarter of the world's industrial manufacturing industries produce defective products and scraps caused by humid air.
Finished electronic components are also exposed to moisture during storage. The production environment of electronic industry products and the storage environment of products should be below 40%. Some varieties of electronic components require lower humidity. Therefore, desiccant is essential in the packaging of electronic components. Montmorillonite desiccant is a good helper for electronic products. The moisture absorption rate is higher than that of silica gel in low humidity environment. Better protect your electronics.